Loongtion

Wide-temperature industrial storage manufacturer (DRAM, SSD, Card, Module). GJB-standard options available.

Users select by form factor × interface × temperature / reliability (Commercial 0–70°C, Wide-temp, GJB-standard). Featured products mirror active campaign SKUs; LP pages are ad landing shells only. EOL products keep their URL; prefer lifecycle=eol over delete.

Primary entry points

• Home
• Products
• Featured products
• DRAM
• SSD
• Card
• Module
• Commercial 0–70°C
• Wide-temp Industrial
• GJB-standard
• Product grade definition (GJB-STD)
• Resources
• About
• Contact
• Custom service

Series hubs

• Industrial DDR3 DRAM — DRAM
• Industrial DDR4 DRAM — DRAM
• Industrial DDR5 DRAM — DRAM
• Industrial DRAM Chips — DRAM
• Industrial eMMC — DRAM
• Industrial LPDDR4X — DRAM
• Industrial M.2 NVMe SSD — SSD
• Industrial NVMe BGA SSD — SSD
• SATA DOM — MODULE

Featured products

• 8Gb DDR4 DRAM Chip · Wide-temp · CN — DRAM
• DDR3 DRAM Chip · Extreme · CN — DRAM, GJB-standard
• Industrial 16Gb DDR5 DRAM Chip — DRAM
• NAND Flash Storage Chip — SSD
• M.2 2280 NVMe SSD (Cacheless) · Wide-temp — SSD
• M.2 2242 NVMe SSD (Cacheless) — SSD
• SATA DOM Module · Wide-temp — MODULE
• eMMC Storage Chip — SSD
• LPDDR4X DRAM Chip — DRAM
• NVMe BGA SSD · Wide-temp — SSD
• M.2 2280 NVMe SSD (With Cache) · Wide-temp — SSD

Campaign landing pages

• Industrial eMMC 5.1 · TLC CN & pSLC GJB-STD | Loongtion
• Industrial Memory Chips | DDR3/DDR4/DDR5 DRAM Supplier | Loongtion
• Industrial NVMe BGA SSD · FBGA291 | Loongtion
• Industrial M.2 NVMe SSD (2280 & 2242) | Loongtion
• Industrial SATA DOM · SLC · CN | Loongtion

Technical resources

• All resources
• SATA DOM Drop-in Fit Guide (Kontron-class & Industrial Boards)
• DDR3 Legacy Replacement: A Field Engineer's Guide
• Migrating from DDR3 to DDR5: A Design-First Integration Framework for Industrial Systems
• Multi-Generational DRAM BOM Strategies: Balancing DDR3, DDR4, and DDR5 in Long-Life Industrial Designs
• DDR4 Signal Integrity Debugging on Multi-Layer Industrial PCBs
• Designing Power-Optimized Edge Nodes: A Scenario-Based Guide to LPDDR4X Low-Power Features
• DDR5 Signal Integrity for Industrial Controllers: Impedance Matching and Layout Strategies
• DDR3 vs DDR4 in Industrial Embedded Systems: A Performance Trade-off Analysis for Migration Decisions
• DDR3 vs DDR4 in Industrial Systems: Supply Chain Risks and Long-Term Design Reliability
• A Systematic Debugging Workflow for DDR4 Signal Integrity Issues in Industrial PCB Designs
• Beyond the Datasheet: Practical Thermal Management for Industrial M.2 NVMe SSDs
• Achieving High Reliability with LPDDR4X in Industrial Edge Computing
• eMMC vs UFS in Industrial Storage Architectures: Protocol Differences and Design Trade-offs
• What Is eMMC? Embedded MultiMediaCard Glossary
• Loongtion DDR3 DRAM chip: Integration and Selection Guide
• Industrial SD and microSD Storage — Protocol and Selection Notes
• NOR Flash for Boot and Firmware Storage in Industrial Devices
• DDR Memory PCB Layout Best Practices for Rugged Systems
• NVMe BGA SSDs for Solder-Down Embedded Storage: A Hardware Design Guide
• M.2 NVMe SSDs for Industrial Computing: A Selection Guide